A Review on Micronchannel and Minichannel Cooling Techniques for High-Density Electronic Devices
DOI:
https://doi.org/10.63282/3050-9416.IJAIBDCMS-V5I3P121Keywords:
High-Density Electronics, Power Converter Miniaturization, Microfabrication, Electronic System Integration, MicrochannelAbstract
Electronic systems for diverse applications have undergone multiple phases of development over the past fifty years. The downsizing of power converters has grown more dependent on a number of parameters, including their high-power density, efficiency, cost, and operating temperature. The present academic review presents a thorough assessment of the microfabrication techniques, advancing the properties of materials, and the cooling ways applied for the smallest and most high-tech electronic devices. Among the recent advances in flexible sensor substrates, the LIGA process, etching, laser micromachining, additive manufacturing, and the coming 3-D surface-enhancement technologies, all have a strong impact on the development of electronic systems that are smaller but still powerful. These advancements go hand in hand with the microchannel cooling methods of single-phase and improved microchannel heat sink that are both analyzed for their capability to manage the growing thermal needs of the compact, high-power devices. The load flow distribution techniques such as both AC and DC load flow methods are also brought up to emphasize their role in assuring reliable electrical performance in complicated power systems. In addition, the main applications of high-density electronics, such as data center optical circuit switching, smart-grid power electronics, LED lighting, and laser-diode operation, are examined in order to demonstrate the real-world impact of the technologies. The study, thus, highlights the significant interaction between microfabrication, thermal management, and system-level applications as one of the major factors that propel the development of next-generation high-density electronic devices.
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